Micron Memory Part Number Decoder [updated]

Before we decode, a critical warning: Legacy parts (DDR2/DDR3) use a slightly different syntax than modern DDR4/DDR5 or LPDRAM.

Micron Technology is a global leader in semiconductor systems, producing vast quantities of DRAM, NAND flash, and solid-state storage. If you handle computer hardware, source components, or manage electronics supply chains, you have likely encountered a long string of characters printed on a Micron chip.

Because Micron updates its catalog frequently as newer lithographies (like 1-alpha, 1-beta, and 1-gamma nodes) debut, using an official database is the safest approach. Step 1: Locate the Numbers

Let's examine a few examples of Micron DRAM part numbers:

The complete technical string (e.g., MT40A512M16LY-062E:E ) used for ordering and locating datasheets. 2. How to Read Micron Part Numbers micron memory part number decoder

Micron Technology is a global leader in semiconductor systems, producing vast quantities of DRAM, NAND flash, and solid-state storage. If you have ever looked at a Micron memory module or chip, you have likely seen a complex string of alphanumeric characters printed on the surface.

: Often found at the end of a part number (e.g., MT...-0SIT TR ), this simply indicates "Tape and Reel" packaging for shipping, as noted on the DigiKey TechForum .

A typical Micron part number (MPN) usually follows this flow:

Micron Technology is a leading manufacturer of memory and storage products, including DRAM, SRAM, Flash, and other types of memory. Micron's product portfolio is vast, with thousands of different part numbers across various product lines. Decoding these part numbers can be a daunting task, especially for engineers, procurement specialists, and distributors who need to identify and source specific memory components. This paper aims to provide a comprehensive guide to decoding Micron memory part numbers, enabling readers to understand the structure and meaning behind these part numbers. Before we decode, a critical warning: Legacy parts

MT53E2G32D4DT-046 AAT:B

Separated by a colon ( : ), this single letter signifies the design generation of the silicon die. : First generation of that specific technology.

By breaking down the part number into these individual categories, you can easily identify replacement parts, verify hardware compatibility, or source components for manufacturing without needing to open a datasheet every time.

: Get detailed timing and configuration data for a full module. 2. Standard Part Number Breakdown (DRAM) Because Micron updates its catalog frequently as newer

| Position | Code | Meaning | | :--- | :--- | :--- | | | MT | Micron Technology (Standard Memory) | | Type | 4 | DRAM (Dynamic RAM) | | | H | Hybrid Memory Cube (HMC) | | Density | 4G | 4 Gigabits | | | 8G | 8 Gigabits | | | 16G | 16 Gigabits | | | 40 | 4 Gigabits (Alt designation) | | | 80 | 8 Gigabits (Alt designation) | | Generation | A | SDR SDRAM | | | B | DDR SDRAM | | | C | DDR2 SDRAM | | | D | DDR3 SDRAM | | | E | DDR4 SDRAM | | | F | DDR5 SDRAM | | | H | LPDDR / LPDDR2 / LPDDR3 / LPDDR4 / LPDDR5 | | | J | GDDR5 / GDDR5X / GDDR6 | | | V | RLDRAM (Reduced Latency) | | | T | Mobile LPDRAM (Low Power) | | Speed | (Varies) | Data Transfer Rate | | | DDR4 Examples: AT (DDR4-2133), 8G (DDR4-3200) | | | DDR5 Examples: BG (DDR5-4800), CK (DDR5-5600) | | | See speed tables below | | Org | 08 | x8 (8-bit wide data bus) | | | 16 | x16 (16-bit wide data bus) | | | 04 | x4 (4-bit wide data bus) | | Package | G | FBGA (Fine-pitch Ball Grid Array) | | | J | BGA (Standard Ball Grid Array) | | | M | TSOP (Thin Small Outline Package) | | Temp Grade | C | Commercial (0°C to +70°C) | | | I | Industrial (-40°C to +85°C) | | | E | Extended (-25°C to +85°C) | | | A | Automotive (-40°C to +95°C) | | | IT | Industrial Temperature (Often used in newer parts) | | Process/Rev | -XX | Die Revision or Manufacturing Process Code (e.g., -093, -AAT) |

After the product family comes the capacity and width. For example, indicates a density of 512 Megabits with a 16-bit wide bus. 4. Speed Bins and Latency The segment after the hyphen (e.g., ) tells you the performance rating. Refers to DDR4-2400 (1200 MHz). Common in DDR5, indicating specific JEDEC speed bins. 5. Die Revision (The "Binning" Secret) The letter at the very end (e.g., Die Revision

If you have a 5-digit code, type it into the search field. The system will automatically return the full manufacturing part number.